Thermal Analysis of Al and Cu Metals Heat Sinks with Different Geometries at Raspberry Pi Control Cards Used for Image Analysis-Based Drone Control in Smart Agriculture Drones
Abstract
A heat sink is a tool for dissipating the heat generated by electronic parts. The equipment's specific operating conditions necessitate the equipment's extra heat dissipation. This research compared and optimized the temperature and heat flux parameters based on the results of the design of a heat sink for CPU, RAM, and PCLe to a USB 3.0 bridge. It is aimed at an examination of the advantages and disadvantages of using square, rectangular, and circular shapes in the design of a heat sink. Copper and aluminum (Al) are the most common heat sink materials (Cu). Autodesk Inventor Pro software with Nastran module is used for design and thermal analysis.
According to Inventor Nastran's thermal analysis results it is found that there is no significant difference between Al and Cu materials based on cooling capacity at designed models. Also, it is found that the geometry of the heat sinks directly affects the cooling capacity of a heat sink.
The application results show that the cooling achievement is directly related to the correct heatsink design and enough surface area.
According to Inventor Nastran's thermal analysis results it is found that there is no important difference between Al and Cu materials based on cooling capacity at designed models. Also, it is found that the geometry of the heat sinks directly affects the cooling capacity of a heat sink.
The application results show that the cooling achievement is directly related to the correct heatsink design and enough surface area.
References
- Anonymous. (2023). The Operating Temperature For A Raspberry Pi. https://copperhilltech.com/content/The%20Operating%20Temperature%20For%20A%20Raspberry%20Pi%20%E2%80%93%20Technologist%20Tips.pdf, accessed 17 March 2023.
- Arefin, A. M. E. (2016). Thermal analysis of modified pin fin heat sink for natural convection. In 2016 5th International Conference on Informatics, Electronics and Vision (ICIEV), 1-5, IEEE.
- Färcaş, C., Ciocan, I., Petreuş, D. & Palaghitä, N. (2012). Thermal modeling and analysis of a power device heat sinks. In 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 217-222, IEEE.
- Huang, H., Yang, A., Tang, Y., Zhuang, J., Hou, C., Tan, Z., Dananjayan, S., He, Y., Guo, Q., Luo, S. (2021). Deep color calibration for UAV imagery in crop monitoring using semantic style transfer with local to global attention. International Journal of Applied Earth Observation and Geoinformation, 104, 102590, https://doi.org/10.1016/j.jag.2021.102590.
- Inoue, Y. (2020). Satellite and drone-based remote sensing of crops and soils for smart farming–a review. Soil Science and Plant Nutrition, 66 (6): 798–810, https://doi.org/10.1080/ 00380768.2020.1738899.
- Kumar, M. P. & Rao, A. U. M. (2018). CFD Analysis on Electronic Heat Sink of Al and Cu Metals. International Journal of Research in Engineering, Science and Management, 1(10): 2581-5792.
- Man, L., Fărcaş, C. & Fizeşan, R. (2010). Packaging and thermal analysis of power electronics modules. In 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 220-225, IEEE.
- Mengjun, J., Chunlei, W., Xinyu Li, G. (2005). Deformation behavior of 6063 aluminum alloy during highspeed compression. The Journal of Wuhan University of Technology-Mater. Sci. Ed., 20(2005): 40–43.
- Negash, L., Kim, H.Y., Choi, H.L. (2019). Emerging UAV applications in agriculture. In: 2019 7th International Conference on Robot Intelligence Technology and Applications (RiTA), 254–257, https://doi.org/10.1109/RITAPP.2019.8932853.
- Özdilli, Ö. & Şevik, S. (2020). Numerical analysis of the cooling performance of heat sinks with different geometries. In MAS 13th International European Conference On Mathematics Engineering Natural and Medical Sciences. Afghanistan, 2020.
- Pal, V. (2014). Modeling and thermal analysis of heat sink with scales on fins cooled by natural convection. International Journal of Research in Engineering and Technology, eISSN: 2319-1163.
- Panday, U.S., Pratihast, A.K., Aryal, J., Kayastha, R.B. (2020). A review on drone-based data solutions for cereal crops. Drones, 4 (3): 1–29. https://doi.org/10.3390/drones4030041.
- Panigrahi, S. K., Jayaganthan, R. (2008). Effect of rolling temperature on microstructure and mechanical properties of 6063 Al alloy. Materials Science and Engineering A, 492(2008): 300–305.
- Panigrahi, S. K., Jayaganthan, R., Pancholi, V. (2009). Effect of plastic deformation conditions on microstructural characteristics and mechanical properties of 6063 Al alloy. Materials and Design, 30(2009): 1894–1901.
- Reddy, S. L. N., Prasad P. H. C. & Hussain, M. (2018). Comparative Thermal Analysis on Heat Sink with Different Geometries. Int. International Journal of Research and Analytical Reviews,5(2), 2127, e ISSN: 2348 –1269, Print ISSN: 2349-5138.
- Seo, B. S., Lee, K. J., Yang, J. K., Cho, Y. S. & Park, D. H. (2012). Development and characterization of optimum heat sink for 30 w chip on board led down-light. Transactions on Electrical and Electronic Materials, 13(6): 292-296.
- Webb, R. L. (2005). Next generation devices for electronic cooling with heat rejection to air. ASME Journal of Heat and Mass Transfer, 127(2005): 2–10.
- Zhang, C., Kovacs, J.M. (2012). The application of small unmanned aerial systems for precision agriculture: a review. Precision Agriculture, 13 (6): 693–712, https://doi.org/10.1007/s11119-012-9274-5.
Akıllı Tarım Drone'larında Görüntü Analizi Tabanlı Drone Kontrolünde Kullanılan Raspberry Pi Kontrol Kartları İçin Farklı Geometrilere Sahip Al ve Cu Metal Isı Alıcılarının Termal Analizi
Abstract
Bir ısı alıcı, elektronik parçalar tarafından üretilen ısıyı dağıtmak için bir araçtır. Ekipmanların belirtilen çalışma koşulları sahip oldukları fazla ısının dağılımını gerektirir. Bu çalışmada, CPU, RAM ve PCLe den USB 3.0 köprüsü için ısı alıcı tasarımındaki sıcaklık ve ısı akışı parametrelerinin sonuçları karşılaştırılıp optimize edilmiştir. Bir ısı alıcı tasarımında kare, dikdörtgen ve dairesel tasarım şekilleri kullanmanın avantaj ve dezavantajlarının incelemesi yapılmıştır. Bakır (Cu) ve alüminyum (Al) en yaygın ısı emici malzemelerdir.
Tasarım ve termal analiz aşamaları için Nastran modülüne sahip Autodesk Inventor Pro yazılımından yararlanılmıştır. Autodesk Inventor Pro Nastran termal analiz sonuçlarına göre, tasarlanan modellerde soğutma kapasitesi bazında Al ve Cu malzemeleri arasında önemli bir fark olmadığı bulunmuştur. Ayrıca sonuç olarak ısı alıcıların geometrisinin bir ısı alıcının soğutma kapasitesini doğrudan etkilediği belirlenmiştir.
Araştırma sonuçları, soğutma başarısının doğru ısı alıcı tasarımı ve yeterli yüzey alanı ile doğrudan ilişkili olduğunu göstermiştir.
References
- Anonymous. (2023). The Operating Temperature For A Raspberry Pi. https://copperhilltech.com/content/The%20Operating%20Temperature%20For%20A%20Raspberry%20Pi%20%E2%80%93%20Technologist%20Tips.pdf, accessed 17 March 2023.
- Arefin, A. M. E. (2016). Thermal analysis of modified pin fin heat sink for natural convection. In 2016 5th International Conference on Informatics, Electronics and Vision (ICIEV), 1-5, IEEE.
- Färcaş, C., Ciocan, I., Petreuş, D. & Palaghitä, N. (2012). Thermal modeling and analysis of a power device heat sinks. In 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), 217-222, IEEE.
- Huang, H., Yang, A., Tang, Y., Zhuang, J., Hou, C., Tan, Z., Dananjayan, S., He, Y., Guo, Q., Luo, S. (2021). Deep color calibration for UAV imagery in crop monitoring using semantic style transfer with local to global attention. International Journal of Applied Earth Observation and Geoinformation, 104, 102590, https://doi.org/10.1016/j.jag.2021.102590.
- Inoue, Y. (2020). Satellite and drone-based remote sensing of crops and soils for smart farming–a review. Soil Science and Plant Nutrition, 66 (6): 798–810, https://doi.org/10.1080/ 00380768.2020.1738899.
- Kumar, M. P. & Rao, A. U. M. (2018). CFD Analysis on Electronic Heat Sink of Al and Cu Metals. International Journal of Research in Engineering, Science and Management, 1(10): 2581-5792.
- Man, L., Fărcaş, C. & Fizeşan, R. (2010). Packaging and thermal analysis of power electronics modules. In 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 220-225, IEEE.
- Mengjun, J., Chunlei, W., Xinyu Li, G. (2005). Deformation behavior of 6063 aluminum alloy during highspeed compression. The Journal of Wuhan University of Technology-Mater. Sci. Ed., 20(2005): 40–43.
- Negash, L., Kim, H.Y., Choi, H.L. (2019). Emerging UAV applications in agriculture. In: 2019 7th International Conference on Robot Intelligence Technology and Applications (RiTA), 254–257, https://doi.org/10.1109/RITAPP.2019.8932853.
- Özdilli, Ö. & Şevik, S. (2020). Numerical analysis of the cooling performance of heat sinks with different geometries. In MAS 13th International European Conference On Mathematics Engineering Natural and Medical Sciences. Afghanistan, 2020.
- Pal, V. (2014). Modeling and thermal analysis of heat sink with scales on fins cooled by natural convection. International Journal of Research in Engineering and Technology, eISSN: 2319-1163.
- Panday, U.S., Pratihast, A.K., Aryal, J., Kayastha, R.B. (2020). A review on drone-based data solutions for cereal crops. Drones, 4 (3): 1–29. https://doi.org/10.3390/drones4030041.
- Panigrahi, S. K., Jayaganthan, R. (2008). Effect of rolling temperature on microstructure and mechanical properties of 6063 Al alloy. Materials Science and Engineering A, 492(2008): 300–305.
- Panigrahi, S. K., Jayaganthan, R., Pancholi, V. (2009). Effect of plastic deformation conditions on microstructural characteristics and mechanical properties of 6063 Al alloy. Materials and Design, 30(2009): 1894–1901.
- Reddy, S. L. N., Prasad P. H. C. & Hussain, M. (2018). Comparative Thermal Analysis on Heat Sink with Different Geometries. Int. International Journal of Research and Analytical Reviews,5(2), 2127, e ISSN: 2348 –1269, Print ISSN: 2349-5138.
- Seo, B. S., Lee, K. J., Yang, J. K., Cho, Y. S. & Park, D. H. (2012). Development and characterization of optimum heat sink for 30 w chip on board led down-light. Transactions on Electrical and Electronic Materials, 13(6): 292-296.
- Webb, R. L. (2005). Next generation devices for electronic cooling with heat rejection to air. ASME Journal of Heat and Mass Transfer, 127(2005): 2–10.
- Zhang, C., Kovacs, J.M. (2012). The application of small unmanned aerial systems for precision agriculture: a review. Precision Agriculture, 13 (6): 693–712, https://doi.org/10.1007/s11119-012-9274-5.
Details
| Primary Language | English |
|---|---|
| Subjects | Agricultural Engineering (Other) |
| Journal Section | Araştırma Makaleleri |
| Authors | |
| Early Pub Date | December 28, 2023 |
| Publication Date | December 30, 2023 |
| Submission Date | August 16, 2023 |
| Acceptance Date | October 9, 2023 |
| Published in Issue | Year 2023 Issue: 378 |
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